International Journal 2026.01: JY Kim, JH Lee, WC Park, and BH Kim. "Experimental study on micro grinding of silicon wafer using polycrystalline diamond tool". Journal of Mechanical Science and Technology.
2026.01: JY Kim, JH Lee, WC Park, and BH Kim. "Experimental study on micro grinding of silicon wafer using polycrystalline diamond tool". Journal of Mechanical Science and Technology.
https://doi.org/10.1007/s12206-026-0242-6