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번호 제목 날짜 아이디
40 2024.01: Ui Seok Lee, Dae Bo Sim, JI Hyo Lee and Bo Hyun Kim. 2024. "Fabrication of Micro Carbon Mold for Glass-Based MIcro Hole Array" Micromachines 15(2), 194. file 2024.03.21 DaeboSim
39 2022.12: Lee, Pyeong An, Ui Seok Lee, Dae Bo Sim, and Bo Hyun Kim. 2023. "Microfluidic Chip Fabrication of Fused Silica Using Microgrinding" Micromachines 14, no. 1: 96. file 2023.01.03 administrator
38 2022.11: Pyeong An Lee and Bo Hyun Kim, A Study of Microdrilling of Fused Silica Using EDMed PCD Tools, Appl. Sci. 2022, 12, 11166. file 2022.11.23 administrator
37 2022.10: Cho, Younghak; Hwang, Jihong; Park, Min-Soo; Kim, Bo Hyun, Fabrication Methods for Microscale 3D Structures on Silicon Carbide, International Journal of Precision Engineering and Manufacturing, 23, 1477–1502, 2022) file 2023.02.11 administrator
36 2021.08: Na, Y.; Lee, U.S.; Kim, B.H. Experimental Study on Micro-Grinding of Ceramics for Micro-Structuring. Appl. Sci. 2021, 11, 8119. file 2021.09.30 ssborry
35 2021.02: Rapid manufacturing of large diameter Cu micropillars by micro-electrical discharge machining and focused ion beam file 2021.03.10 lus223
34 2020.7: Superhydrophobic Polymer Surface with Hierarchical Patterns Fabricated in Hot Imprinting Process, International Journal of Precision Engineering and Manufacturing-Green Technology, 2019 file 2019.09.10 bhkim
33 2020.02: An Analytical Model for Grinding Force Prediction in Ultra-Precision Machining of WC with PCD Micro Grinding Tool file 2020.02.20 ssborry
32 2019.12: Woo Kyun Kim, Dalei Xi, Bo Hyun Kim, Nanoscale indentation and scratching tests of single crystal sapphire using molecular dynamics simulation, Computational Materials Science, Vol. 170, 109105 file 2019.09.10 bhkim
31 2019.03. Jihong Hwang, Young Hak Cho, Min Soo Park, Bo Hyun Kim, Microchannel Fabrication on Glass Materials for Microfluidic Devices, International Journal of Precision Engineering and Manufacturing, Vol. 20, No. 3, pp. 479-495, 2019 file 2019.03.25 bhkim
30 2017.09: Woo Kyun Kim, Bo Hyun Kim, A molecular dynamics study on atomistic mechanisms of nano-scale cutting process of sapphire, Journal of Mechanical Science and Technology, Vol. 31, No. 9, pp. 4353-4362, 2017. file 2017.09.12 bhkim
29 2016.05: Jung, S. M., Lee, P. A., Kim, B. H., "Surface polishing of quartz-based microfluidic channelsusing CO2 laser", Microfluidics and Nanofluidics, Vol. 20, No. 6, 10404-016-1748-8, 2016 file 2016.05.23 jsman6589
28 2016.03: D. M. Kim, I. E. Lee, S. K. Kim, B. H. Kim, H. W. Park, "Influence of a micropatterned insert on characteristics of the tool-workpiece interface in a hard turning process", Journal of Materials Processing Technology, Vol. 229, 160- file 2015.10.07 prema
27 2016.01: "Micro/nano-hybrid lens for enhancing light extraction using micro-milling and anodic aluminium oxide (AAO)", Journal of Micromechanics and Microengineering, Vol. 26, No. 1, 015010, 2016, doi:10.1088/0960-1317/26/1/015010 file 2015.12.04 prema
26 2015.12: P. A. Lee, Y. H. Kim, B. H. Kim, "Effect of Low Frequency Vibration on Micro EDM Drilling", International Journal of Precision Engineering and Manufacturing, Vol. 16, No. 13, pp. 2617-2622 file 2015.10.10 prema
25 2015.06: D. M. Kim, Vivek Bajpai, B. H. Kim, H. W. Park, "Finite element modeling of hard turning process via a micro-textured tool", International Journal of Advanced Manufacturing Technology, Vol.78, Issue 9, pp 1393-1405, 2015 file 2015.10.07 prema
24 2015.01: Khac-Ha Nguyen, P. A. Lee, B. H. Kim, "Experimental investigation of ECDM for fabricating micro structures of quartz", International Journal of Precision Engineering and Manufacturing, Vol. 16, Issue 1, pp 5-12, 2015 file 2015.10.07 prema
23 2013.04: Choi, S. H., Kim, B. H., Shin, H. S., Chung, D. K. and Chu, C. N., "Analysis of the Electrochemical Behaviors of Wc–Co Alloy for Micro ECM," Journal of Materials Processing Technology, Vol. 213, No. 4, pp. 621-630, 2013 file 2013.04.18 admin
22 2013.04: Cho, Y. H., Lee, K. Y., Moon, I. Y., Kim, B. H., Park, K., Facile Fabrication of Superhydrophobic Poly(Methyl Methacrylate) Substrates using Ultrasonic Imprinting, Journal of Micromechanics and Microengineering, Vol. 23, 055019, 201 file 2013.04.18 admin
21 2013.01: X. D. Cao, B. H. Kim,C. N. Chu, Hybrid Micromachining of Glass Using ECDM and Micro Grinding, International Journal of Precision Engineering and Manufacturing, Vol. 14, No. 1, pp. 5-10, 2013 file 2013.01.03 t310