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3 |
2025.05: B. H. Kim, J. Y. Kim, Study on Micro Grinding of Silicon Wafer, 2025년도 한국정밀공학회 춘계학술대회
 | 2025.05.19 | JYKim | 1 |
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2 |
2025.04: Kim J. Y, Lee, J. H., Kim, B. H., Micro Hole Machining Characteristics of Glassy Carbon Using Electrical Discharge Machining (EDM), Journal of the Korean Society for Precision Engineering, Vol.42, No. 4, pp. 325-332, 2025
| 2025.04.08 | JYKim | 49 |
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1 |
2024.05: J. Y. Kim, J. H. Lee, D. B. Sim, B. H. Kim Ductile Mode Cutting of Glassy Carbon Using PCD Tool, 한국정밀공학회 2024년도 춘계학술대회
| 2024.05.14 | JYKim | 335 |
